Matthew D. Romig

City:

Richardson, Texas

Country:

United States

Published Applications:

Last publication date:

2014-06-26

Top Assignees for applications by Matthew D. Romig

The entities that hold a legal rights for patent applications filed by inventor Romig Matthew D.:

TEXAS INSTRUMENTS INCORPORATED 9 Dallas, TX United States

Recent patent applications by Romig Matthew D.

Matthew D. Romig from Richardson, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-06-26

US20140179064A1

Electricity

METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION

#2 | 2014-03-06

US20140061884A1

Electricity

Stacked die power converter

#3 | 2014-02-06

US20140038358A1

Electricity

Method for contacting agglomerate terminals of semiconductor packages

#4 | 2013-12-05

US20130320514A1

Electricity

Package-in-Package for High Heat Dissipation Having Leadframes and Wire Bonds

#5 | 2013-05-30

US20130134579A1

Electricity

Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate

#6 | 2012-10-30

US13177734

Structure and method for uniform current distribution in power supply module

#7 | 2012-08-23

US20120211889A1

Electricity

Semiconductor device having agglomerate terminals

#8 | 2011-03-24

US20110070700A1

Electricity

Method for connecting integrated circuit chip to power and ground circuits

#9 | 2011-01-20

US20110012035A1

Electricity

Method for Precision Symbolization Using Digital Micromirror Device Technology

#10 | 2008-04-10

US20080083981A1

Electricity

Thermally Enhanced BGA Packages and Methods

InventorID:

554095 ⎘