Brian M. Erwin

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER

PROTECTION OF ELEMENTS ON A LAMINATE SURFACE

Element place on laminates

Security mesh and method of making

Laminate warpage control

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER

Under die surface mounted electrical elements

Security mesh and method of making

Passivation layer topography

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ETCH-STOP MATERIAL DAMAGE

Dual layer stack for contact formation

Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer

Use of electrolytic plating to control solder wetting

LASER ETCHING SYSTEM INCLUDING MASK RETICLE FOR MULTI-DEPTH ETCHING

SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT

Substrate including selectively formed barrier layer

SELECTIVE PLATING WITHOUT PHOTORESIST

Substrate including selectively formed barrier layer

Organic coating to inhibit solder wetting on pillar sidewalls

SELECTIVE PLATING WITHOUT PHOTORESIST

Universal solder joints for 3D packaging

Semiconductor device including passivation layer encapsulant

Redistribution layer (RDL) with variable offset bumps

Coaxial solder bump support structure