Mascalucia
Italy
27
2025-12-25
The entities that hold a legal rights for patent applications filed by inventor Minotti Agatino:
Agatino Minotti from Mascalucia, IT has applied for patents for these inventions. The list has both pending applications and granted patents:
POWER SEMICONDUCTOR DEVICE WITH A DOUBLE ISLAND SURFACE MOUNT PACKAGE
#2 | 2025-10-16CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#3 | 2025-03-13PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPECTIONABILITY AND MANUFACTURING METHOD THEREOF
#4 | 2024-12-26BLOCKING ELEMENT FOR CONNECTING PINS OF SEMICONDUCTOR DICE
#5 | 2023-10-05PACKAGED ELECTRONIC DEVICE COMPRISING A PLURALITY OF POWER TRANSISTORS
#6 | 2023-09-07Power semiconductor device with a double island surface mount package
#7 | 2022-10-06CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#8 | 2022-04-07Blocking element for connecting pins of semiconductor dice
#9 | 2022-03-17Packaged semiconductor device having improved reliability and inspectionability and manufacturing method thereof
#10 | 2021-05-27Power semiconductor device with a double island surface mount package
#11 | 2020-07-16Microelectronic device having protected connections and manufacturing process thereof
#12 | 2019-10-24Power semiconductor device with a double island surface mount package
#13 | 2019-03-21Microelectronic device having protected connections and manufacturing process thereof
#14 | 2017-12-21Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
#15 | 2017-07-13Thermoelectric energy harvesting device and method of harvesting environmental energy
#16 | 2017-03-02Electronic power module with enhanced thermal dissipation and manufacturing method thereof
#17 | 2016-05-26Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
#18 | 2016-04-28Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device
#19 | 2016-04-07ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS
#20 | 2014-01-02Flip-chip electronic device and production method thereof
#21 | 2013-12-05Electronic device for power applications
#22 | 2012-12-20Intelligent power module and related assembling method
#23 | 2012-08-30Stacked multi-die electronic device with interposed electrically conductive strap
#24 | 2011-12-01Electronic device and method for connecting a die to a connection terminal
#25 | 2011-10-27DIE PACKAGE AND CORRESPONDING METHOD FOR REALIZING A DOUBLE SIDE COOLING OF A DIE PACKAGE
#26 | 2010-06-24Process and system for manufacturing an encapsulated semiconductor device
#27 | 2005-12-15Vertical conduction power electronic device package and corresponding assembling method
554162 ⎘