Xiaojin Wei

City:

Dublin, California

Country:

United States

Published Applications:

Last publication date:

2025-08-21

Top Assignees for applications by Xiaojin Wei

The entities that hold a legal rights for patent applications filed by inventor Wei Xiaojin:

Xiaojin Wei from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

MULTI-CHIP MODULE PACKAGE TECHNOLOGY FOR ADVANCED DRIVER ASSISTANCE SYSTEM APPLICATION

Modular Liquid Cooling Architecture For Liquid Cooling

Three Dimensional IC Package with Thermal Enhancement

Temperature control element utilized in device die packages

Modular liquid cooling architecture for liquid cooling

Three dimensional IC package with thermal enhancement

InventorID:

5548023 ⎘