Daewon PARK

City:

Busan

Country:

South Korea

Published Applications:

Last publication date:

2022-10-27

Top Assignees for applications by Daewon PARK

The entities that hold a legal rights for patent applications filed by inventor PARK Daewon:

Daewon PARK from Busan, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Finger-type expansion joint device without drainage sheet

InventorID:

5558368 ⎘