Mario Palma

City:

Espoo

Country:

Finland

Published Applications:

Last publication date:

2022-11-10

Top Assignees for applications by Mario Palma

The entities that hold a legal rights for patent applications filed by inventor Palma Mario:

Mario Palma from Espoo, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

Electroplating for vertical interconnections

SUPERCONDUCTING THROUGH SUBSTRATE VIAS

InventorID:

5572878 ⎘