Keiichi Endoh

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2023-10-05

Top Assignees for applications by Keiichi Endoh

The entities that hold a legal rights for patent applications filed by inventor Endoh Keiichi:

DOWA ELECTRONICS MATERIALS CO., LTD. 6 Tokyo, Japan

Recent patent applications by Endoh Keiichi

Keiichi Endoh from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-10-05

US20230311249A1

Performing operations; transporting

METAL PASTE FOR BONDING AND BONDING METHOD

#2 | 2020-03-26

US20200094318A1

Performing operations; transporting

BONDING MATERIAL AND BONDING METHOD EMPLOYING SAME

#3 | 2020-01-30

US20200035637A1

Electricity

BONDING MATERIAL AND BONDED PRODUCT USING SAME

#4 | 2019-09-19

US20190283129A1

Performing operations; transporting

Bonding material and bonding method using same

#5 | 2019-04-25

US20190118257A1

Performing operations; transporting

Joining material and joining method using same

#6 | 2018-11-15

US20180331063A1

Electricity

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

#7 | 2016-09-01

US20160254243A1

Electricity

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR JOINING ELECTRONIC PART

#8 | 2016-04-14

US20160101486A1

Performing operations; transporting

Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method

#9 | 2013-12-05

US20130323529A1

Performing operations; transporting

Bonding material and bonding body, and bonding method

InventorID:

557760 ⎘