Muenchen
Germany
3
2023-06-22
Michael LANGENBUCH from Muenchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor Package, Semiconductor Die and Method for Forming a Semiconductor Package or a Semiconductor Die
#2 | 2023-06-22Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconductor Device, and Methods
#3 | 2022-11-17Apparatus, Device, Method and Computer Program for an Integrated Development Environment
5577846 ⎘