Eiji KUSUNOKI

City:

Hyogo

Country:

Japan

Published Applications:

Last publication date:

2022-11-24

Top Assignees for applications by Eiji KUSUNOKI

The entities that hold a legal rights for patent applications filed by inventor KUSUNOKI Eiji:

Eiji KUSUNOKI from Hyogo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for producing hot melt adhesive and hot melt adhesive

InventorID:

5582898 ⎘