Yu Chen Lee

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2026-04-16

Top Assignees for applications by Yu Chen Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Yu Chen:

REALTEK SEMICONDUCTOR CORP. 2 Hsinchu, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 2 Hsinchu, Taiwan
Taiwan Semiconductor Manufacturing Company Limited 1 Hsinchu, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 1 Hsinchu, Taiwan

Recent patent applications by Lee Yu Chen

Yu Chen Lee from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-16

US20260106627A1

Electricity

DIGITAL TO ANALOG CONVERSION SYSTEM AND DIGITAL TO ANALOG CONVERSION METHOD

#2 | 2026-04-09

US20260100721A1

Electricity

DIGITAL TO ANALOG CONVERSION SYSTEM AND DIGITAL TO ANALOG CONVERSION METHOD

#3 | 2026-01-08

US20260011622A1

Electricity

HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS

#4 | 2024-11-14

US20240379494A1

Electricity

HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS

#5 | 2023-12-21

US20230411234A1

Electricity

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

#6 | 2023-11-16

US20230369164A1

Electricity

HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS

#7 | 2023-03-02

US20230063270A1

Electricity

Semiconductor die package with ring structure and method for forming the same

#8 | 2023-01-19

US20230018343A1

Electricity

Package assembly including lid with additional stress mitigating feet and methods of making the same

#9 | 2022-12-01

US20220384304A1

Electricity

High efficiency heat dissipation using discrete thermal interface material films

InventorID:

5592874 ⎘