Li JIANG

City:

Allen, Texas

Country:

United States

Published Applications:

Last publication date:

2025-03-27

Top Assignees for applications by Li JIANG

The entities that hold a legal rights for patent applications filed by inventor JIANG Li:

TEXAS INSTRUMENTS INCORPORATED 4 Dallas, TX United States

Recent patent applications by JIANG Li

Li JIANG from Allen, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-03-27

US20250105104A1

Electricity

QUAD FLAT NO-LEAD PACKAGE WITH ENHANCED CORNER PADS FOR BOARD LEVEL RELIABILITY

#2 | 2024-10-03

US20240332433A1

Electricity

CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES

#3 | 2024-09-12

US20240304517A1

Electricity

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

#4 | 2024-04-18

US20240128170A1

Electricity

HYBRID CHIP CARRIER PACKAGE

#5 | 2024-01-04

US20240006267A1

Electricity

Hermetic Package Cooling Using Silver Tubes with Getter Absorption Material

#6 | 2023-11-02

US20230352387A1

Electricity

Built-In Serial Via Chain for Integrity Monitoring of Laminate Substrate

#7 | 2023-06-22

US20230197642A1

Electricity

Ceramic semiconductor package seal rings

#8 | 2023-02-02

US20230035716A1

Electricity

High-frequency ceramic packages with modified castellation and metal layer architectures

#9 | 2022-12-01

US20220384369A1

Electricity

Ceramic semiconductor package seal rings

InventorID:

5592893 ⎘