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Inventor profile of:

Yu DU

City:

Chicago, Illinois

Country:

United States

Published Applications:

Last publication date:

2025-08-07

Top Assignees for applications by Yu DU

The entities that hold a legal rights for patent applications filed by inventor DU Yu:

HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED 11 Stamford, CT United States

Recent patent applications by DU Yu

Yu DU from Chicago, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-08-07

US20250254453A1

Electricity

APPARATUS AND METHOD FOR MEMS MICROPHONE PERFORMANCE VIA BACK VOLUME

#2 | 2025-05-22

US20250162468A1

Performing operations; transporting

SEAT-EMBEDDED SPEECH SENSORS

#3 | 2025-04-03

US20250113132A1

Electricity

THIN PANEL SURFACE MOUNT MICROPHONE

#4 | 2025-04-03

US20250109982A1

Physics

WATERPROOF SOUND AND VIBRATION SENSING DEVICE

#5 | 2024-09-05

US20240294130A1

Performing operations; transporting

SYSTEM AND METHOD FOR ACTIVATING REMOTE CONTROL VEHICLE SYSTEM FUNCTIONS USING VOICE COMMANDS

#6 | 2024-05-02

US20240144950A1

Physics

System and method for switching a frequency response and directivity of microphone

#7 | 2024-03-14

US20240089644A1

Electricity

Apparatus and method for MEMS microphone performance via back volume

#8 | 2023-11-16

US20230366727A1

Physics

MULTI-STAGE STRUCTURE-BORNE SOUND AND VIBRATION SENSOR

#9 | 2023-09-21

US20230296428A1

Physics

Vibration sensor having a surface-integrated transducer

#10 | 2023-04-13

US20230114156A1

Electricity

Apparatus and method for MEMS microphone performance via back volume

#11 | 2023-02-16

US20230049919A1

Physics

Seat-embedded speech sensors

#12 | 2022-12-01

US20220386039A1

Electricity

Multi-stage structure-borne sound and vibration sensor

#13 | 2022-12-01

US20220386038A1

Electricity

Structure-borne sound and vibration sensor

InventorID:

5593920 ⎘