Kyoto
Japan
6
2024-07-11
Daisuke HISHITANI from Kyoto, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
THREE-DIMENSIONAL MODELING APPARATUS AND THREE-DIMENSIONAL MODELING METHOD
#2 | 2024-04-25THREE-DIMENSIONAL MODELING APPARATUS AND THREE-DIMENSIONAL MODELING METHOD
#3 | 2024-02-29SUBSTRATE PROCESSING APPARATUS
#4 | 2024-02-01OPTICAL APPARATUS AND THREE-DIMENSIONAL MODELING APPARATUS
#5 | 2023-10-05IMAGING DEVICE, INSPECTION DEVICE, INSPECTION METHOD AND SUBSTRATE PROCESSING APPARATUS
#6 | 2023-01-123-DIMENSIONAL SHAPING APPARATUS
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