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Inventor profile of:

Daisuke HISHITANI

City:

Kyoto

Country:

Japan

Published Applications:

6

Last publication date:

2024-07-11

Recent patent applications by HISHITANI Daisuke

Daisuke HISHITANI from Kyoto, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-07-11
US20240227291A9
Performing operations; transporting

THREE-DIMENSIONAL MODELING APPARATUS AND THREE-DIMENSIONAL MODELING METHOD

#2 | 2024-04-25
US20240131788A1
Performing operations; transporting

THREE-DIMENSIONAL MODELING APPARATUS AND THREE-DIMENSIONAL MODELING METHOD

#3 | 2024-02-29
US20240071793A1
Electricity

SUBSTRATE PROCESSING APPARATUS

#4 | 2024-02-01
US20240036344A1
Physics

OPTICAL APPARATUS AND THREE-DIMENSIONAL MODELING APPARATUS

#5 | 2023-10-05
US20230314343A1
Physics

IMAGING DEVICE, INSPECTION DEVICE, INSPECTION METHOD AND SUBSTRATE PROCESSING APPARATUS

#6 | 2023-01-12
US20230012047A1
Performing operations; transporting

3-DIMENSIONAL SHAPING APPARATUS

InventorID:

5630249 ⎘

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