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Inventor profile of:

Qingfeng CUI

City:

Zhuhai

Country:

China

Published Applications:

1

Last publication date:

2023-01-19

Recent patent applications by CUI Qingfeng

Qingfeng CUI from Zhuhai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-01-19

US20230014845A1

Performing operations; transporting

PACKAGING PART, PACKAGING ASSEMBLY, AND CHIP READ WRITE METHOD USING PACKAGING PART

InventorID:

5632338 ⎘