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Inventor profile of:

Boyan YU

City:

Beijing

Country:

China

Published Applications:

1

Last publication date:

2023-01-26

Recent patent applications by YU Boyan

Boyan YU from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-01-26

US20230021319A1

METHOD AND APPARATUS FOR ROUTING WIRES ON CHAIN QUANTUM CHIP, AND STORAGE MEDIUM

InventorID:

5637068 ⎘