Yang LV

City:

Ningbo

Country:

China

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Yang LV

The entities that hold a legal rights for patent applications filed by inventor LV Yang:

Yang LV from Ningbo, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

PAD, LEAD FRAME, AND SENSOR PACKAGING STRUCTURE FOR ATTENUATING EDDY CURRENT EFFECT

LEAD-WIRE FRAME STRUCTURE FOR PACKAGING AND SENSOR PACKAGE STRUCTURE

PACKAGED CHIP AND CURRENT SENSOR

HIGH-VOLTAGE SAMPLING CIRCUIT, HIGH-VOLTAGE SAMPLING METHOD, AND BATTERY MANAGEMENT SYSTEM

Chip type coil-based fluxgate current sensor

Manufacturing method for fluxgate chip

Measurement circuit of thin-film temperature sensor

InventorID:

5641452 ⎘