Loic SANCHEZ

City:

Grenoble Cedex 09

Country:

France

Published Applications:

Last publication date:

2026-04-23

Top Assignees for applications by Loic SANCHEZ

The entities that hold a legal rights for patent applications filed by inventor SANCHEZ Loic:

Commissariat A L'Energie Atomique Et Aux Energies Alternatives 2 Paris, France
SET CORPORATION 1 Saint-Jeoire, France

Recent patent applications by SANCHEZ Loic

Loic SANCHEZ from Grenoble Cedex 09, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-23

US20260114320A1

Electricity

DIE TO WAFER DIRECT HYBRID BONDING METHOD

#2 | 2023-01-26

US20230029338A1

Electricity

METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING

InventorID:

5643814 ⎘