Thomas Voss

City:

Frankfurt (Oder)

Country:

Germany

Published Applications:

Last publication date:

2025-01-16

Recent patent applications by Voss Thomas

Thomas Voss from Frankfurt (Oder), DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-16

US20250022839A1

Electricity

METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING

#2 | 2023-06-15

US20230187301A1

Electricity

FAN-OUT WAFER-LEVEL PACKAGE

#3 | 2023-02-02

US20230030354A1

Chemistry; metallurgy

METHOD FOR ANNEALING BONDING WAFERS

InventorID:

5644638 ⎘