Brian Veraa

City:

Round Rock, Texas

Country:

United States

Published Applications:

Last publication date:

2025-08-14

Top Assignees for applications by Brian Veraa

The entities that hold a legal rights for patent applications filed by inventor Veraa Brian:

Brian Veraa from Round Rock, US has applied for patents for these inventions. The list has both pending applications and granted patents:

SPARE ENGINEERING CHANGE ORDER CELL COVERAGE WITHIN INTEGRATED CIRCUIT DESIGNS

HIGH-CURRENT TOLERANT IC DESIGN WITH PLACEMENT-AWARE ANTENNA DIODE INSERTION

EFFECTIVE METAL DENSITY SCREENS FOR HIERARCHICAL DESIGN RULE CHECKING (DRC) ANALYSIS

Avoiding electrostatic discharge events from cross-hierarchy tie nets

InventorID:

5659324 ⎘