Jae-Wung Lee

City:

Espoo

Country:

Finland

Published Applications:

Last publication date:

2026-04-02

Top Assignees for applications by Jae-Wung Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Jae-Wung:

Jae-Wung Lee from Espoo, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

WAFER LEVEL PACKAGE FOR DEVICE

Bonding structure

Packaging of microelectromechanical system devices

Bonding Structure

Wafer level package for device

Wafer level package for device

InventorID:

5660679 ⎘