Rena Miyazaki

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2023-02-23

Top Assignees for applications by Rena Miyazaki

The entities that hold a legal rights for patent applications filed by inventor Miyazaki Rena:

Rena Miyazaki from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Blister package, method for manufacturing blister package, and RF device using blister package

InventorID:

5667902 ⎘