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Inventor profile of:

Chia-Chen LEE

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2025-11-27

Top Assignees for applications by Chia-Chen LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Chia-Chen:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 11 Hsinchu, Taiwan

Recent patent applications by LEE Chia-Chen

Chia-Chen LEE from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-27

US20250364402A1

Electricity

INTERCONNECTION STRUCTURE

#2 | 2025-05-29

US20250174492A1

Electricity

INTERCONNECTION STRUCTURE HAVING AIR GAP

#3 | 2025-05-22

US20250167042A1

Electricity

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD FOR MANUFACTURING THE SAME

#4 | 2025-05-08

US20250149437A1

Electricity

INTERCONNECTION STRUCTURE

#5 | 2025-04-17

US20250125148A1

Electricity

METHOD FOR TWO-DIMENSIONAL MENTAL LINE PATTERNING

#6 | 2025-03-06

US20250079295A1

Electricity

INTERCONNECTION STRUCTURE

#7 | 2024-12-19

US20240420994A1

Electricity

INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME

#8 | 2024-12-12

US20240413075A1

Electricity

INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHOD FOR MANUFACTURING THE SAME

#9 | 2024-11-14

US20240379537A1

Electricity

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE

#10 | 2024-10-31

US20240363347A1

Electricity

METHOD FOR METAL PATTERNING

#11 | 2023-03-02

US20230067527A1

Electricity

Semiconductor structure having deep metal line and method for forming the semiconductor structure

InventorID:

5674822 ⎘