Jun IKEDA

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2023-03-09

Recent patent applications by IKEDA Jun

Jun IKEDA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-03-09

US20230071071A1

Chemistry; metallurgy

RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, RESIN MOLDED PRODUCT FOR SEALING OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE

InventorID:

5677601 ⎘