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Inventor profile of:

Martin HEIGL

City:

München

Country:

Germany

Published Applications:

2

Last publication date:

2023-11-16

Recent patent applications by HEIGL Martin

Martin HEIGL from München, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-11-16

US20230369529A1

PHOTODIODE WITH ORTHOGONAL LAYER STRUCTURE

#2 | 2023-03-23

US20230087266A1

Method for Producing a Three-Dimensionally Integrated Semiconductor Memory

InventorID:

5690427 ⎘