Thalwil
Switzerland
38
2024-10-24
The entities that hold a legal rights for patent applications filed by inventor Brunschwiler Thomas:
Thomas Brunschwiler from Thalwil, CH has applied for patents for these inventions. The list has both pending applications and granted patents:
EFFICIENT ANALYSIS OF IMAGE DATA USING UNCERTAINTY MAPS
#2 | 2021-11-18Semi-supervised learning with group constraints
#3 | 2021-09-23Personalized copper block for selective solder removal
#4 | 2021-01-28Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste
#5 | 2020-12-17Particle-based, anisotropic composite materials for magnetic cores
#6 | 2020-11-12Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#7 | 2020-05-07Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#8 | 2020-03-05Disconnect assembly for active cooling of packaged electronics
#9 | 2020-01-09Disconnect assembly for active cooling of packaged electronics
#10 | 2019-02-07Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#11 | 2019-01-31Printed circuit board with edge soldering for high-density packages and assemblies
#12 | 2018-09-13High-performance compliant heat-exchanger comprising vapor chamber
#13 | 2018-03-29Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#14 | 2018-03-29Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#15 | 2017-12-14Cooling device with nested chambers for computer hardware
#16 | 2017-07-13POROUS UNDERFILL ENABLING REWORK
#17 | 2016-02-18Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#18 | 2016-02-18Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#19 | 2015-08-06Transferring heat through an optical layer of integrated circuitry
#20 | 2015-04-16Integrated device with defined heat flow
#21 | 2014-04-03Transferring heat through an optical layer of integrated circuitry
#22 | 2014-03-27Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#23 | 2014-03-27Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#24 | 2013-12-12Optimizing heat transfer in 3-D chip-stacks
#25 | 2012-12-27Electronic Device Having an Electrode with Enhanced Injection Properties
#26 | 2012-11-15Optimized semiconductor packaging in a three-dimensional stack
#27 | 2012-11-01COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS
#28 | 2012-07-26Transferring heat through an optical layer of integrated circuitry
#29 | 2012-07-26Integrated device with defined heat flow
#30 | 2012-05-03Heat sink integrated power delivery and distribution for integrated circuits
#31 | 2012-05-03Thermal power plane for integrated circuits
#32 | 2012-05-03Optimized semiconductor packaging in a three-dimensional stack
#33 | 2010-12-09Electronic device having an electrode with enhanced injection properties
#34 | 2010-03-04Cooling system for an electronic component system cabinet
#35 | 2009-12-17Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#36 | 2009-12-17Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#37 | 2009-04-30Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#38 | 2006-02-23Electronic device having an electrode with enhanced injection properties
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