De WU

City:

Ezhou

Country:

China

Published Applications:

Last publication date:

2024-12-26

Top Assignees for applications by De WU

The entities that hold a legal rights for patent applications filed by inventor WU De:

De WU from Ezhou, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Liquid epoxy molding compound and preparation method thereof

Liquid molding compound and preparation method thereof

Liquid molding compound for protecting five edges of semiconductor chip and preparation method thereof

InventorID:

5696402 ⎘