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Inventor profile of:

Daniel Katzman

City:

Boulder, Colorado

Country:

United States

Published Applications:

1

Last publication date:

2023-03-30

Recent patent applications by Katzman Daniel

Daniel Katzman from Boulder, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-03-30

US20230096345A1

Phone Case with Thermal Ground Plane

InventorID:

5697478 ⎘