Brian M. Koronkiewicz

City:

Pasadena, Maryland

Country:

United States

Published Applications:

Last publication date:

2023-03-30

Top Assignees for applications by Brian M. Koronkiewicz

The entities that hold a legal rights for patent applications filed by inventor Koronkiewicz Brian M.:

THE JOHNS HOPKINS UNIVERSITY 1 Baltimore, MD United States

Recent patent applications by Koronkiewicz Brian M.

Brian M. Koronkiewicz from Pasadena, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-03-30

US20230097635A1

Performing operations; transporting

Microcapsules for use with polyurethane and epoxy adhesives

InventorID:

5698571 ⎘