William E. Bernier

City:

Endicott, New York

Country:

United States

Published Applications:

Last publication date:

2023-04-06

Top Assignees for applications by William E. Bernier

The entities that hold a legal rights for patent applications filed by inventor Bernier William E.:

OPERATIONS TECHNOLOGY DEVELOPMENT, NFP 1 Des Plaines, IL United States

Recent patent applications by Bernier William E.

William E. Bernier from Endicott, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-04-06

US20230105420A1

Physics

RESILIENT DIRECT PART MARKING ON CARBON STEEL USING LASER ENGRAVING AND COATING PROCESSES

InventorID:

5704647 ⎘