Naohiro KIMURA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2023-04-13

Top Assignees for applications by Naohiro KIMURA

The entities that hold a legal rights for patent applications filed by inventor KIMURA Naohiro:

IHI CORPORATION 1 Tokyo, Japan

Recent patent applications by KIMURA Naohiro

Naohiro KIMURA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-04-13

US20230112177A1

Physics

SYSTEM FOR EVALUATING DISTRIBUTION OF FIBER BUNDLES IN FIBER REINFORCED MATERIAL

#2 | 2022-07-07

US20220216114A1

Electricity

METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

InventorID:

5709807 ⎘