Daniel Peral Crespo

City:

Barcelona

Country:

Spain

Published Applications:

Last publication date:

2023-04-20

Recent patent applications by Peral Crespo Daniel

Daniel Peral Crespo from Barcelona, ES has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-04-20

US20230118005A1

Performing operations; transporting

ELECTROCHEMICALLY DEBONDABLE ADHESIVE COMPOSITION

InventorID:

5714424 ⎘