Daniel SHRIVES

City:

Harvard, Massachusetts

Country:

United States

Published Applications:

Last publication date:

2023-05-04

Top Assignees for applications by Daniel SHRIVES

The entities that hold a legal rights for patent applications filed by inventor SHRIVES Daniel:

Daniel SHRIVES from Harvard, US has applied for patents for these inventions. The list has both pending applications and granted patents:

COMPOSITE BODY HAVING HIGH THERMAL CONDUCTIVITY AND METHOD OF MAKING THE COMPOSITE BODY

COMPOSITE BODY HAVING HIGH THERMAL CONDUCTIVITY AND METHOD OF MAKING THE COMPOSITE BODY

InventorID:

5718657 ⎘