Ryosuke IEKI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-04-18

Top Assignees for applications by Ryosuke IEKI

The entities that hold a legal rights for patent applications filed by inventor IEKI Ryosuke:

DAICEL CORPORATION 2 Osaka-shi, Osaka, Japan
DAIKIN INDUSTRIES, LTD. 1 Osaka-shi, Osaka, Japan

Recent patent applications by IEKI Ryosuke

Ryosuke IEKI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-04-18

US20240124314A1

Chemistry; metallurgy

PARTICLE-IMMOBILIZED SUBSTRATE, METHOD FOR PRODUCING PARTICLE-IMMOBILIZED SUBSTRATE, METHOD FOR PRODUCING DIAMOND-FILM-IMMOBILIZED SUBSTRATE, AND METHOD FOR PRODUCING DIAMOND

#2 | 2023-04-27

US20230129711A1

Mechanical engineering

LAMINATE

InventorID:

5723766 ⎘