Jipu Lei

City:

Eindhoven

Country:

Netherlands

Published Applications:

Last publication date:

2015-05-28

Top Assignees for applications by Jipu Lei

The entities that hold a legal rights for patent applications filed by inventor Lei Jipu:

Jipu Lei from Eindhoven, NL has applied for patents for these inventions. The list has both pending applications and granted patents:

Chip scale light emitting device with metal pillars in a molding compound formed at wafer level

P-N separation metal fill for flip chip LEDs

LED having vertical contacts redistruted for flip chip mounting

InventorID:

573240 ⎘