Hsinchu
Taiwan
8
2022-02-24
The entities that hold a legal rights for patent applications filed by inventor Singh Sunil Kumar:
Sunil Kumar Singh from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Etch damage and ESL free dual damascene metal interconnect
#2 | 2019-09-12Etch damage and ESL free dual damascene metal interconnect
#3 | 2018-02-01Etch damage and ESL free dual damascene metal interconnect
#4 | 2016-07-21Etch damage and ESL free dual damascene metal interconnect
#5 | 2014-07-03Addition of carboxyl groups plasma during etching for interconnect reliability enhancement
#6 | 2014-06-26Interconnection wires of semiconductor devices
#7 | 2014-05-01Etch damage and ESL free dual damascene metal interconnect
#8 | 2013-12-19Etch damage and ESL free dual damascene metal interconnect
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