Toshihide SUNADA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-03-19

Top Assignees for applications by Toshihide SUNADA

The entities that hold a legal rights for patent applications filed by inventor SUNADA Toshihide:

Toshihide SUNADA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

BONDING DEVICE AND BONDING METHOD

FRICTION STIR WELDING METHOD AND BATTERY PACK

BATTERY CASE AND MANUFACTURING METHOD THEREOF

DEBURRING TOOL

FRICTION STIR WELDING METHOD AND FRICTION STIR WELDING APPARATUS

InventorID:

5740784 ⎘