Meridian, Idaho
United States
32
2026-06-25
The entities that hold a legal rights for patent applications filed by inventor Chen Jiewei:
Jiewei Chen from Meridian, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMORY DEVICE INCLUDING CONDUCTIVE STRUCTURES AND LANDING STRUCTURES
#2 | 2026-04-16MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING STRENGTHENED INTERMEDIATE REGIONS OF ASSOCIATED INSULATIVE STRUCTURES, AND RELATED SYSTEMS
#3 | 2026-03-19Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells And Memory Arrays Comprising Strings Of Memory Cells
#4 | 2026-03-05Memory Circuitry and Method Used in Forming Memory Circuitry
#5 | 2026-02-05RIVET ISOLATION AND METHOD
#6 | 2026-02-05Memory Circuitry and Method Used in Forming Memory Circuitry
#7 | 2026-01-22Integrated Circuitry And Methods Used In Forming Integrated Circuitry
#8 | 2025-12-18MICROELECTRONIC DEVICES AND RELATED MEMORY DEVICES
#9 | 2025-12-11MEMORY DEVICE INCLUDING CONDUCTIVE CONTACTS AND SUPPORT STRUCTURES
#10 | 2025-11-20DYNAMIC LATCHES ABOVE A THREE-DIMENSIONAL NON-VOLATILE MEMORY ARRAY
#11 | 2025-10-02METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING BLOCK AND SUB-BLOCK STRUCTURES, AND RELATED ELECTRONIC DEVICES
#12 | 2025-10-02METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING AIR GAP, AND RELATED ELECTRONIC DEVICES AND SYSTEMS
#13 | 2025-09-04Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
#14 | 2025-08-14Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells
#15 | 2025-06-19CREATING DYNAMIC LATCHES ABOVE A THREE-DIMENSIONAL NON-VOLATILE MEMORY ARRAY
#16 | 2025-03-20DEVICE TEMPERATURE ADJUSTMENT
#17 | 2024-03-07ELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES EXHIBITING A WEAVE PATTERN, AND RELATED MEMORY DEVICES, SYSTEMS, AND METHODS
#18 | 2024-02-29DYNAMIC LATCHES ABOVE A THREE-DIMENSIONAL NON-VOLATILE MEMORY ARRAY
#19 | 2024-02-29Memory Circuitry And Method Used In Forming Memory Circuitry
#20 | 2024-02-29Creating dynamic latches above a three-dimensional non-volatile memory array
#21 | 2024-02-08Memory Circuitry And Method Used In Forming Memory Circuitry
#22 | 2024-02-08Memory Circuitry And Method Used In Forming Memory Circuitry
#23 | 2023-12-07MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND RELATED ELECTRONIC SYSTEMS AND METHODS
#24 | 2023-12-07MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE REGIONS OF STEP TREADS, AND RELATED SYSTEMS AND METHODS
#25 | 2023-12-07Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells
#26 | 2023-11-30Memory Circuitry And Method Used In Forming Memory Circuitry
#27 | 2023-09-14Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells And Memory Arrays Comprising Strings Of Memory Cells
#28 | 2023-09-14METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
#29 | 2023-06-29MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING STRENGTHENED INTERMEDIATE REGIONS OF ASSOCIATED INSULATIVE STRUCTURES, AND RELATED SYSTEMS AND METHODS
#30 | 2023-06-29Methods used in forming a memory array comprising strings of memory cells
#31 | 2023-05-25Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells
#32 | 2023-05-25Device temperature adjustment
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