Daohong YANG

City:

Wuhan

Country:

China

Published Applications:

Last publication date:

2025-10-23

Top Assignees for applications by Daohong YANG

The entities that hold a legal rights for patent applications filed by inventor YANG Daohong:

Daohong YANG from Wuhan, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

TSV ELECTRICAL CONNECTION STRUCTURE HAVING HIGH ASPECT RATIO AND MANUFACTURING METHOD THEREFOR

ACTIVE PIXEL CIRCUIT, IMAGE SENSOR, AND ELECTRONIC DEVICE

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

InventorID:

5757101 ⎘