David A. Ruben

STACKABLE MULTI ELECTRODE SENSOR ARRAY PROVIDING MODULARITY IN MAKING MULTIANALYTE SENSING DEVICES

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

ENCLOSURES WITH HERMETIC FEEDTHROUGHS

System And Method For Valve Control

HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES

Hermetic assembly and device including same

NOISE REDUCTION FOR SENSOR APPARATUS

Surface texturing using energy pulses

Sealed package and method of forming same

Electronic package and device including same

Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate

Nuclear radiation particle power converter

KINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURES AND METHODS

Hermetic assembly and device including same

Laser cutting system

Methods for forming hermetically-sealed packages including feedthrough assemblies

SEALED PACKAGE INCLUDING ELECTRONIC DEVICE AND POWER SOURCE

Sealed package and method of forming same

Power source and method of forming same

Hermetic conductive feedthroughs for a semiconductor wafer

Sealed package and method of forming same

Surface texturing using energy pulses

Power source and method of forming same

Sealed implantable medical device and method of forming same

Hermetically-sealed packages including feedthrough assemblies

Nuclear radiation particle power converter

Kinetically limited nano-scale diffusion bond structures and methods

Sealed package and method of forming same

Feedthrough assemblies and methods of forming same

IMPLANTABLE MEDICAL DEVICES AND METHODS OF FORMING SAME

Power source and method of forming same

Sealed package and method of forming same

Embedded metallic structures in glass

Sealed package including electronic device and power source

SEALED IMPLANTABLE MEDICAL DEVICE AND METHOD OF FORMING SAME

Power source and method of forming same

Wafer-scale package including power source

Hermetically-sealed packages including feedthrough assemblies

Feedthrough assemblies

Kinetically limited nano-scale diffusion bond structures and methods

Implantable medical device system including feedthrough assembly and method of forming same

Devices formed with techniques for bonding substrates using an intermediate layer

Nuclear radiation particle power converter

Hermetic conductive feedthroughs for a semiconductor wafer

Techniques for bonding substrates using an intermediate layer

HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS

Wafer-scale package including power source

Power sources suitable for use in implantable medical devices and corresponding fabrication methods

Implantable capacitive pressure sensor apparatus and methods regarding same

Techniques for bonding substrates using an intermediate layer

Error correction techniques in surgical navigation

Wafer-scale package including power source

Laser assisted direct bonding

Hermetic wafer-to-wafer bonding with electrical interconnection

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

Hermeticity testing

HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS

Pressure sensor configurations for implantable medical electrical leads

Pressure sensor configurations for implantable medical electrical leads

Metallization with tailorable coefficient of thermal expansion

Layered structure for corrosion resistant interconnect contacts

Encapsulation circuitry on a substrate

Media-exposed interconnects for transducers

Laser bonding tool with improved bonding accuracy

Assembly including a circuit and an encapsulation frame, and method of making the same

Electrical connection through nonmetal

Implantable medical device including a surface-mount terminal array

Freeform substrates and devices