Inventor profile of:

Mike Kwon

City:

Pleasanton, California

Country:

United States

Published Applications:

13

Last publication date:

2018-08-30

Top Assignees for applications by Mike Kwon

The entities that hold a legal rights for patent applications filed by inventor Kwon Mike:

Recent patent applications by Kwon Mike

Mike Kwon from Pleasanton, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-08-30
US20180247921A1
Electricity

Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

#2 | 2017-11-23
US20170338209A1
Electricity

Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

#3 | 2017-08-24
US20170244008A1
Electricity

Substrate free LED package

#4 | 2017-08-03
US20170221865A1
Electricity

Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

#5 | 2016-07-07
US20160197061A1
Electricity

Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

#6 | 2015-11-19
US20150333045A1
Electricity

Packaging photon building blocks having only top side connections in a molded interconnect structure

#7 | 2014-07-17
US20140197430A1
Electricity

Substrate free LED package

#8 | 2014-05-15
US20140131747A1
Electricity

Packaging photon building blocks having only top side connections in a molded interconnect structure

#9 | 2014-03-20
US20140077235A1
Electricity

Substrate free LED package

#10 | 2014-02-20
US20140048832A1
Electricity

Micro-bead blasting process for removing a silicone flash layer

#11 | 2013-12-19
US20130337592A1
Electricity

Micro-bead blasting process for removing a silicone flash layer

#12 | 2013-05-30
US20130134459A1
Electricity

Micro-bead blasting process for removing a silicone flash layer

#13 | 2012-07-26
US20120187430A1
Electricity

Packaging photon building blocks having only top side connections in a molded interconnect structure

InventorID:

577369 ⎘