🔗 Permalink

Inventor profile of:

John Carlo Molina

City:

Limay

Country:

Philippines

Published Applications:

Last publication date:

2026-04-30

Recent patent applications by Molina John Carlo

John Carlo Molina from Limay, PH has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-30

US20260123408A1

Electricity

ELECTRONIC DEVICE COOLING WITH INTEGRATED MAGNETICS

#2 | 2026-04-02

US20260096495A1

Electricity

MICROELECTRONIC ASSEMBLY WITH INTEGRATED PASSIVE COMPONENT AND SEMICONDUCTOR DEVICE

#3 | 2025-12-04

US20250373226A1

Electricity

BULK ACOUSTIC WAVE CAVITY ISOLATION FROM DIE ATTACH MATERIAL OUTGASSING

#4 | 2025-12-04

US20250372472A1

Electricity

TOPSIDE COOLING BAND FOR MULTIPLE ELECTRONIC COMPONENTS

#5 | 2025-09-25

US20250301672A1

Electricity

INTEGRATED MAGNETIC COMPONENT IN ELECTRONIC APPARATUS

#6 | 2025-05-29

US20250174525A1

Electricity

RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT

#7 | 2025-04-03

US20250111985A1

Electricity

LEAD STRUCTURE FOR AN INDUCTIVE COIL

#8 | 2025-03-27

US20250105195A1

Electricity

ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT INCLUDES A TAPERED FOOT PORTION

#9 | 2024-09-26

US20240322786A1

Electricity

Bulk Acoustic Wave (BAW) Microresonator Package

#10 | 2024-06-20

US20240203801A1

Electricity

TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR

#11 | 2024-03-28

US20240105557A1

Electricity

NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTRUDED CONTACTS

#12 | 2024-02-22

US20240063107A1

Electricity

CRACK ARREST FEATURES FOR MIULTILEVEL PACKAGE SUBSTRATE

#13 | 2023-11-23

US20230378146A1

Electricity

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT

#14 | 2023-06-22

US20230197575A1

Electricity

DIE ATTACH ADHESIVE-READY LEAD FRAME DESIGN

InventorID:

5779510 ⎘