Chun Ping Lo

City:

Allen, Texas

Country:

United States

Published Applications:

Last publication date:

2026-06-04

Top Assignees for applications by Chun Ping Lo

The entities that hold a legal rights for patent applications filed by inventor Lo Chun Ping:

Chun Ping Lo from Allen, US has applied for patents for these inventions. The list has both pending applications and granted patents:

THERMAL BAR STRUCTURE IN AN EMBEDDED TRACE SUBSTRATE

SUBSTRATE PACKAGE HAVING MOISTURE DISSIPATION CHANNELS

MICROELECTRONIC DEVICE PACKAGE WITH HYBRID ISOLATION LAMINATE

ELECTRONIC DEVICE DUAL SIDE MOLDED SOLDERMASKLESS PACKAGE SUBSTRATE PACKAGE FOR IMPROVED THERMAL DISSIPATION AND THERMOMECHANICAL INTEGRITY

MULTILEVEL PACKAGE SUBSTRATE WITH STAIR SHAPED SUBSTRATE TRACES

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT

Multilevel package substrate with stair shaped substrate traces

InventorID:

5786765 ⎘