Ryan Simpson

City:

Maricopa, Arizona

Country:

United States

Published Applications:

Last publication date:

2023-08-17

Top Assignees for applications by Ryan Simpson

The entities that hold a legal rights for patent applications filed by inventor Simpson Ryan:

Ryan Simpson from Maricopa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Continuous wire bonds for battery module

In-process wire bond testing using wire bonding apparatus

InventorID:

5793496 ⎘