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Inventor profile of:

Roveendra PAUL

City:

Dublin, California

Country:

United States

Published Applications:

Last publication date:

2026-06-18

Top Assignees for applications by Roveendra PAUL

The entities that hold a legal rights for patent applications filed by inventor PAUL Roveendra:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 12 Scottsdale, AZ United States
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 2 Phoenix, AZ United States

Recent patent applications by PAUL Roveendra

Roveendra PAUL from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-18

US20260173902A1

Electricity

CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES

#2 | 2026-06-18

US20260173271A1

Electricity

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

#3 | 2026-06-11

US20260165130A1

Electricity

HEAT DISSPATION DEVICE HAVING DUAL-COUPLED FIN

#4 | 2026-03-26

US20260089898A1

Electricity

COOLING APPARATUS FOR POWER MODULES

#5 | 2026-03-05

US20260068033A1

Electricity

SEMICONDUCTOR MODULES

#6 | 2025-01-30

US20250038066A1

Electricity

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS

#7 | 2024-07-11

US20240237216A9

Electricity

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

#8 | 2024-04-25

US20240138069A1

Electricity

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

#9 | 2024-04-25

US20240136259A1

Electricity

CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES

#10 | 2024-04-18

US20240128197A1

Electricity

ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS

#11 | 2024-02-22

US20240064944A1

Electricity

SEALING METHOD FOR DIRECT LIQUID COOLED POWER ELECTRONICS PACKAGE

#12 | 2023-07-13

US20230225044A1

Electricity

STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES

InventorID:

5800052 ⎘