Hsinchu County
Taiwan
3
2023-12-14
The entities that hold a legal rights for patent applications filed by inventor Chen Chun-Wei:
Chun-Wei Chen from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE HAVING GROUND BONDING WIRE THAT CROSSES OVER SIGNAL BONDING WIRE FOR CROSSTALK REDUCTION AND ASSOCIATED METHOD
#2 | 2023-12-14SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING MUTUAL INDUCTANCE BETWEEN BOND WIRES TO REALIZE BOND WIRE T-COIL CIRCUIT WITH EQUIVALENT NEGATIVE INDUCTANCE
#3 | 2023-07-27Semiconductor package with conductive adhesive that overflows for return path reduction and associated method
5811067 ⎘