Hsinchu
Taiwan
20
2026-01-15
The entities that hold a legal rights for patent applications filed by inventor Datye Isha:
Isha Datye from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABRICATING THEREOF
#2 | 2025-11-20INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
#3 | 2025-11-20SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD OF MANUFACTURING THEREOF
#4 | 2025-11-13INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREADER LAYERS
#5 | 2025-10-30PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
#6 | 2025-10-30INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
#7 | 2025-07-10SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#8 | 2025-07-03INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
#9 | 2025-06-26INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
#10 | 2025-06-19SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING METHOD THEREOF
#11 | 2025-06-19THERMAL CHARACTERIZATION METHOD AND MANUFACTURING OF SEMICONDUCTOR PACKAGE
#12 | 2025-06-12SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#13 | 2025-06-12SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING METHOD THEREOF
#14 | 2025-05-22PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
#15 | 2025-05-08SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD OF MANUFACTURING THEREOF
#16 | 2025-05-01INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
#17 | 2025-05-01INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
#18 | 2025-05-01SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABRICATING THEREOF
#19 | 2025-05-01INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREADER LAYERS
#20 | 2023-07-27MEMORY DEVICE AND METHOD OF FORMING THE SAME AND INTEGRATED CIRCUIT
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