Bong-Sub Lee

City:

Mountain View, California

Country:

United States

Published Applications:

Last publication date:

2017-12-28

Top Assignees for applications by Bong-Sub Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Bong-Sub:

INVENSAS CORPORATION 4 San Jose, CA United States
TESSERA INC. 1 San Jose, CA United States

Recent patent applications by Lee Bong-Sub

Bong-Sub Lee from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-12-28

US20170374738A1

Electricity

Interposers with electrically conductive features having different porosities

#2 | 2017-04-06

US20170099733A1

Electricity

Interposers

#3 | 2016-07-28

US20160218057A1

Electricity

Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks

#4 | 2015-12-03

US20150348940A1

Electricity

Structure and method for integrated circuits packaging with increased density

#5 | 2014-02-06

US20140034283A1

Mechanical engineering

OPERATIONAL CONTROL OF ELECTROHYDRODYNAMIC (EHD) AIR MOVER AND ELECTRODE CONDITIONING MECHANISM

#6 | 2013-12-26

US20130340981A1

Mechanical engineering

ELECTROHYDRODYNAMIC (EHD) AIR MOVER CONFIGURATION WITH FLOW PATH EXPANSION AND/OR SPREADING FOR IMPROVED OZONE CATALYSIS

InventorID:

582106 ⎘