Ryo AWANE

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2026-01-15

Top Assignees for applications by Ryo AWANE

The entities that hold a legal rights for patent applications filed by inventor AWANE Ryo:

Ryo AWANE from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

ELECTRICAL DEBONDING ADHESIVE SHEET, JOINED BODY, AND JOINING AND SEPARATION METHOD FOR ADHEREND

ELECTRICAL DEBONDING ADHESIVE SHEET, JOINED BODY, AND JOINING AND SEPARATION METHOD FOR ADHEREND

Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend

InventorID:

5824379 ⎘