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Inventor profile of:

Gary LIU

City:

Hsinchu

Country:

Taiwan

Published Applications:

7

Last publication date:

2025-11-20

Top Assignees for applications by Gary LIU

The entities that hold a legal rights for patent applications filed by inventor LIU Gary:

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 7 Hsinchu, Taiwan

Recent patent applications by LIU Gary

Gary LIU from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-20
US20250357195A1
Electricity

SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANCE AND METHOD FOR MANUFACTURING THE SAME

#2 | 2025-05-22
US20250167042A1
Electricity

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD FOR MANUFACTURING THE SAME

#3 | 2025-05-08
US20250149436A1
Electricity

INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURING THE SAME

#4 | 2025-04-24
US20250132247A1
Electricity

INTERCONNECTION STRUCTURE

#5 | 2024-10-31
US20240363400A1
Electricity

SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANCE AND METHOD FOR MANUFACTURING THE SAME

#6 | 2024-07-11
US20240234203A1
Electricity

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELECTRICAL BREAKDOWN PERFORMANCE, AND METHOD FOR MANUFACTURING THE SAME

#7 | 2023-08-17
US20230260831A1
Electricity

Semiconductor device having metallization layer with low capacitance and method for manufacturing the same

InventorID:

5828068 ⎘

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