Wuhan
China
12
2025-04-03
The entities that hold a legal rights for patent applications filed by inventor SU Junxing:
Junxing SU from Wuhan, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
WAFER THINNING TAPE AND PREPARATION METHOD THEREOF, AND WAFER GRINDING METHOD
#2 | 2025-03-18Packaging film and preparation method thereof, and filter chip packaging method
#3 | 2025-03-13Wafer warpage regulation epoxy functional film, and preparation method and application thereof
#4 | 2024-06-06Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure
#5 | 2024-02-15Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrate
#6 | 2024-01-25DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
#7 | 2024-01-11Chip protective film and method for manufacturing same, and chip
#8 | 2024-01-04Composition, adhesive film and chip packaging structure
#9 | 2023-09-21HIGH-GLOSSINESS EPOXY MOLDING COMPOUND (EMC) FILM FOR PROTECTING CHIP AND PREPARATION METHOD THEREOF
#10 | 2023-08-24Adhesive, die attach film and preparation method therefor
#11 | 2023-08-17Underfill for chip packaging and chip packaging structure
#12 | 2022-03-29Circuit build-up film for wafer-level packaging, and fabrication method and use thereof
5828115 ⎘